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Wafer De-Taping Tape-F914WT

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Shenzhen KHJ Technology Co., Ltd

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Wafer De-Taping Tape-F914WT

Brand Name : KHJ

Model Number : F914WT

Certification : RoHS

Place of Origin : ShenZhen China

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Description

F914WT Wafer De-Taping Tape is polyester film backed with releasing coating and coated with rubber adhesive.It has excellent adhesion to PE/PVC and with good resistance of high temperature. It is ideal to peel the BG tape from wafer,glass and silicone or other temporary fixing tape.

Construction

Wafer De-Taping Tape-F914WT

Features

● High-temperature removal without adhesive residual

● Excellent instant sticking Anti-static performance.

Application

The product can be used in the fixing, connecting and packaging environments with high temperature requirements, and can also be used as temporary bonding, marking and electronic packaging.

Properties

Item	Typical Value		Test Method
Item	Imperial	Metric	Test Method
Backing	2mil	0.05mm	/
Total Thickness	3.2mil	0.08mm	/
Adhesion to Steel	≥3.11lbs/in	≥17N/25mm	GB 2792-2014
Tensile Strength	≥17.14lbs/in	≥3(KN/M)	GB 30776-2014
Elongation	≥100%	≥100%	GB 30776-2014
Temperature resistance	OK	OK	100℃*10min

Storage

● Store under normal conditions of 10-30℃ and 40-70% R.H, out of direct sunlight.

● Shelf life: 12 months from the date of manufacture when stored in initial packing.

Precaution Reminder

● Surface should be clean, dry, free of dust, oil or other contaminants.

● Proper pressure required by roller, hand or press when applying.

● Avoid repeat sticking to prevent adhesion decrease.

Notes

Please be advised that this technical data sheet is written based on our lab tests and experience only. Customer is responsible to determine the suitability of the product meets intended application requirements before approved for use.

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